IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

Fourteen out of 33 IC product types are expected to show growth of better than 2% this year, says IC Insights. Fourteen product categories—topped by Cellphone Application Processors and Signal ...